1. 2. 3. material content data sheet sales product name tca785 issued 28. august 2013 ma# MA001043164 package pg-dip-16-4 weight* 1031.43 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.357 0.62 0.62 6163 6163 leadframe inorganic material phosphorus 7723-14-0 0.109 0.01 106 non noble metal zinc 7440-66-6 0.436 0.04 423 non noble metal iron 7439-89-6 8.719 0.85 8453 non noble metal copper 7440-50-8 354.021 34.32 35.22 343233 352215 wire noble metal gold 7440-57-5 0.394 0.04 0.04 382 382 encapsulation organic material carbon black 1333-86-4 3.216 0.31 3118 inorganic material antimonytrioxide 1309-64-4 12.866 1.25 12474 plastics brominated resin - 12.866 1.25 12474 plastics epoxy resin - 131.874 12.79 127855 inorganic material silicondioxide 60676-86-0 482.466 46.77 62.37 467763 623684 leadfinish non noble metal tin 7440-31-5 15.796 1.53 1.53 15315 15315 plating noble metal silver 7440-22-4 0.358 0.03 0.03 347 347 glue plastics epoxy resin - 0.586 0.06 568 noble metal silver 7440-22-4 1.367 0.13 0.19 1326 1894 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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